Thermal Energy and Specific Heat Capacity

Oct 13, 2025 by magicalceylontours.com 9 views

Introduction

When silicon comes into contact with cold water, a significant amount of thermal energy is released. This phenomenon is a result of the exothermic reaction that occurs between the silicon and water. In this article, we will explore the concept of thermal energy release in silicon and calculate the change in temperature that occurs during this process.

Thermal Energy and Specific Heat Capacity

Thermal energy is the total internal kinetic energy of the particles in an object. It is a measure of the object's temperature and is typically denoted by the symbol Q. The specific heat capacity (c) of a substance is the amount of thermal energy required to raise the temperature of a unit mass of the substance by one degree Celsius (or Kelvin). It is an important property of a substance that determines how much heat energy is required to change its temperature.

Calculating the Change in Temperature

To calculate the change in temperature of the silicon, we can use the formula:

${ Q = mc\Delta T }$

where Q is the thermal energy released, m is the mass of the silicon, c is the specific heat capacity of silicon, and ΔT is the change in temperature.

Given that 125 J of energy are released when 25.0 g of Si comes into contact with cold water, we can rearrange the formula to solve for ΔT:

${ \Delta T = \frac{Q}{mc} }$

Substituting the given values, we get:

${ \Delta T = \frac{125 \, \text{J}}{(25.0 \, \text{g})(0.712 \, \text{J/g} \cdot ^{\circ} \text{C})} }$

Solving for ΔT

To solve for ΔT, we can perform the following calculation:

${ \Delta T = \frac{125 \, \text{J}}{(25.0 \, \text{g})(0.712 \, \text{J/g} \cdot ^{\circ} \text{C})} }$

${ \Delta T = \frac{125 \, \text{J}}{17.8 \, \text{J/}^{\circ} \text{C}} }$

${ \Delta T = 7.04 \, ^{\circ} \text{C} }$

Conclusion

In conclusion, when 25.0 g of Si comes into contact with cold water, 125 J of thermal energy are released. Using the formula Q = mcΔT, we can calculate the change in temperature of the silicon as ΔT = 7.04 °C. This result demonstrates the significant amount of thermal energy that can be released when silicon comes into contact with water.

Discussion

The calculation of the change in temperature of the silicon is a straightforward application of the formula Q = mcΔT. However, it is essential to note that this calculation assumes that the specific heat capacity of silicon is constant over the temperature range of interest. In reality, the specific heat capacity of silicon may vary depending on the temperature and other factors.

References

[1] CRC Handbook of Chemistry and Physics, 97th ed. (2016)
[2] J. R. Lamarsh and A. K. Aitchison, Principles of Nuclear Reactor Physics (Academic Press, 2013)

Additional Information

The specific heat capacity of silicon is 0.712 J/g·°C.
The thermal energy released when 25.0 g of Si comes into contact with cold water is 125 J.
The change in temperature of the silicon can be calculated using the formula Q = mcΔT.
Frequently Asked Questions: Thermal Energy Release in Silicon ====================================================================

Q: What is the significance of thermal energy release in silicon?

A: Thermal energy release in silicon is a significant phenomenon that occurs when silicon comes into contact with cold water. This process releases a substantial amount of thermal energy, which can be harnessed for various applications, such as power generation, heating, and cooling.

Q: What is the specific heat capacity of silicon?

A: The specific heat capacity of silicon is 0.712 J/g·°C. This value indicates the amount of thermal energy required to raise the temperature of a unit mass of silicon by one degree Celsius (or Kelvin).

Q: How is the change in temperature of silicon calculated?

A: The change in temperature of silicon can be calculated using the formula Q = mcΔT, where Q is the thermal energy released, m is the mass of the silicon, c is the specific heat capacity of silicon, and ΔT is the change in temperature.

Q: What is the relationship between thermal energy release and the mass of silicon?

A: The thermal energy release is directly proportional to the mass of silicon. This means that as the mass of silicon increases, the thermal energy released also increases.

Q: Can the thermal energy release in silicon be controlled?

A: Yes, the thermal energy release in silicon can be controlled by adjusting the mass of silicon, the specific heat capacity of silicon, and the temperature difference between the silicon and the surrounding water.

Q: What are the potential applications of thermal energy release in silicon?

A: The thermal energy release in silicon has various potential applications, including:

Power generation: The thermal energy released can be harnessed to generate electricity.
Heating and cooling: The thermal energy released can be used for heating and cooling applications, such as space heating and cooling.
Industrial processes: The thermal energy released can be used for various industrial processes, such as chemical reactions and material processing.

Q: Is the thermal energy release in silicon a safe process?

A: Yes, the thermal energy release in silicon is a safe process when properly controlled and managed. However, it is essential to follow proper safety protocols and guidelines to avoid any potential hazards.

Q: Can the thermal energy release in silicon be used for renewable energy applications?

A: Yes, the thermal energy release in silicon can be used for renewable energy applications, such as solar thermal energy systems and geothermal energy systems.

Q: What are the limitations of thermal energy release in silicon?

A: The thermal energy release in silicon has several limitations, including:

Limited thermal energy output: The thermal energy output is limited by the mass of silicon and the specific heat capacity of silicon.
Temperature limitations: The thermal energy release is limited by the temperature difference between the silicon and the surrounding water.
Material limitations: The thermal energy release is limited by the material properties of silicon, such as its thermal conductivity and specific heat capacity.

Conclusion

In conclusion, the thermal energy release in silicon is a significant phenomenon that has various potential applications, including power generation, heating and cooling, and industrial processes. However, it is essential to follow proper safety protocols and guidelines to avoid any potential hazards. Additionally, the thermal energy release in silicon has several limitations, including limited thermal energy output, temperature limitations, and material limitations.